基本释义:

适用晶圆尺寸

网络释义

1)acceptable wafer size,适用晶圆尺寸

2)WLCSP,晶圆尺寸级封装

3)WCSP,晶圆级芯片尺寸封装

4)proper visual angle,适宜尺寸

5)appropriate size,适当尺寸

6)grain size,晶粒尺寸

用法和例句

Research on the thermal stress and warpage of WLCSP device

晶圆尺寸级封装器件的热应力及翘曲变形

Wafer chip scale packaging(WCSP) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.

晶圆级芯片尺寸封装(WCSP)消除了类似传统的芯片键合、引线键合和倒装芯片贴装过程的封装工序。

Influence of wire rolling process parameters on austenite grain size of high carbon steel;

高碳钢线材轧制工艺参数对晶粒尺寸的影响

Prediction of the flow behavior and grain size during forming for nickel alloy heavy forging;

镍基合金大锻件成形过程流变行为与晶粒尺寸预测

Modelling for grain size and flow stress of magnesium alloy based on BP neural network;

基于BP神经网络的镁合金晶粒尺寸及流变应力模型

Research on the thermal stress and warpage of WLCSP device

晶圆尺寸级封装器件的热应力及翘曲变形

Reliability of SOP Component Solder Joint

小尺寸封装(SOP)器件焊点可靠性研究

Packaging--Dimensions of cylinder transport package

GB/T13201-1997圆柱体运输包装尺寸系列

Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;

功率载荷下叠层芯片尺寸封装热应力分析

A Study on Thermal Stress and Invalidation for Chip Scale Package;

芯片尺寸封装（CSP）的热应力及热失效分析研究

SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING

电子封装微互连焊点力学行为的尺寸效应

Woodruff keys--Types and dimensions

GB/T1099-1979半圆键型式尺寸

sizematic internal grinder

自动定尺寸内圆磨床

Study on Al Pad Contamination Sources During Wafer Fabrication,Shipping and Assembly

晶圆制造、运输、封装过程中Al焊垫污染源的研究

Eventually closed all the screw compressor assembly drawings, plans and dimensions of all the main components map.

最终形成全封闭螺杆压缩机总装配图、形尺寸图和各主零件图。

Pressureless Infiltration of SiCp/Al Electronic Packaging Materials with Particles of Bimodal Size Distribution;

无压浸渗制备双尺寸颗粒SiCp/Al电子封装材料的研究

Finite-Element Simulation and Solder Joint Life Predictions for Chip Scale Ball Grid Array Size Package;

球栅阵列尺寸封装的有限元法模拟及焊点的寿命预测分析

Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging

电磁感应加热尺寸效应及其BGA封装互连新方法特征研究

Integrated power electronics module based on chip scale packaged power devices

基于芯片尺寸封装功率器件的集成电力电子模块(英文)

a graded change in the magnitude of some physical quantity or dimension.

数量尺寸的级别变化。

middle-of-the-road class

(小客车等的) 中等尺寸级

Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging

MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究

End-suction centrifugal pumps--Baseplate and installation dimensions

GB/T5660-1985轴向吸入离心泵底座尺寸和安装尺寸