基本释义:

碎裂变质

网络释义

1)cataclastic metamorphism,碎裂变质

2)katamorphism,碎裂变质

3)catachosis,碎裂变质（地）

4)katamorphic zone,碎裂变质带

5)fragmentation,碎裂

6)Break,碎裂

7)fracture,碎裂

8)cataclasm,碎裂

9)splintering,碎裂

10)shatter crack,碎裂

用法和例句

A better transition layer material was confirmed,which overcame the problem of fragmentation and lamination of PDC.

确定了一种效果较好的过渡层,较好地解决了金刚石/硬质合金复合片碎裂及分层的问题。

The fragmentation influences the char combustion behavior in a fluidized bed combustor.

利用下行气流振动床代替流化床 ,研究了煤的碎裂特性 。

Based on the perturbative QCD predictions of gluonic distributions and branch cross section of the J/(?) decay via hadronic, electromagnetic,and radiative channels, the strict solutions of LUND area law of string fragmentation had-ronization are used to treat nonperturbative hadronic production processes, a possible description and Monte Carlo packet for the J/(?) hadronic decay are obtained.

基于微扰QCD所预言的J/ψ衰变道胶子分布及其分支截面和LUND弦碎裂模型强子化面积定律的严格解,得到J/ψ所有衰变模式的微扰和非微扰过程的一种可能的描述,相应的Monte Carlo产生器LUARLW所作的初步模拟结果与BES获取的J/ψ数据的多种带电粒子谱分布和事例形状拓扑分布符合较好。

An Analysis on Break of Separating Ring for Horizontal Concasting and Improved Measures;

水平连铸分离环碎裂的分析和改进措施

The results show that the fracture process of weathering is a fractal one.

因此,分形维至少有2个数值,一为结晶颗粒粒度分形维,一为碎裂颗粒粒度分形维。

Failures of IC smart cards,caused by fracture of thin/ultra-thin Si chip,break of wire bonding or ESD etc.

分析研究了IC智能卡芯片碎裂、引线键合断裂、静电放电损伤等失效模式和失效机理,并结合IC卡制造工艺和失效IC卡的分析实例,对引起这些失效的根本原因作了深入探讨,就提升制造成品率、改善可靠性提出应对措施。

The fracture of thin/ultra-thin silicon dies accounts for half of the failures of IC cards,and its failure modes and failure mechanism are not well understood then.

薄/超薄芯片的碎裂占据IC卡早期失效的一半以上,其失效模式、失效机理亟待深入研究。