基本释义:

须

网络释义

1)Xu(须),须

2)whisker,晶须

3)whisker,锡须

4)tin whisker,锡须

5)Sn whisker,Sn须

6)whiskers,晶须

用法和例句

As a Verb in ancient Chinese,"Xu(须)" has been through the process of grammaticalization: auxiliary-adverb-conjunction,when syntactic,semantic and pragmatic factors have all played important roles.

动词"须"经历了"助动词-副词-连词"的语法化历程。

Research on the preparation of basic magnesium sulfate whisker with organic acid by hydrothermal method;

添加有机酸水热法制备碱式硫酸镁晶须的研究

Preparation of magnesium oxide whisker from basic magnesium sulfate by sintering method;

碱式硫酸镁烧结法制备氧化镁晶须

Antistatic performance of ZnO whisker in polyacrylonitrile(PAN) fiber;

渗入氧化锌晶须的聚丙烯腈纤维的抗静电性

Analyse and prove the principle of whisker growth.

本文介绍了近年来电子工业中锡和锡铅合金电镀的应用情况,探讨了各种替代Sn-Pb合金的无铅可焊性合金镀层,并对这些工艺做出了评价,分析论证了锡须生长的原理,指出了无铅可焊性电镀的发展方向。

Growth of tin whisker on lead-free solder coated leads of flexible printed circuit;

挠性电路板引脚嵌合部无铅镀层的锡须生长

Research progress of growth mechanism of tin whisker;

锡须生长机理的研究进展

The focuses are placed on the types of recently developed lead-free solders,evaluation of mechanical properties of their joints,reliability and durability issues of packaged systems,as well as some new challenging issues emerged recently,such as electromigration and tin whisker.

对目前国内外电子和光子封装用无铅钎料研究和应用的新进展和发展趋势进行了回顾、评述和展望,重点评述了无铅钎料的种类和钎焊接头的力学性能、封装结构的可靠性和耐久性,以及目前出现的影响电子封装可靠性的一些新问题(如电迁移和锡须问题)。

Relations between the chemical composition of Sn finish and Sn whisker growth under temperature cycling;

温度循环条件下电镀液配方对镀层Sn须生长的影响

Sn whisker growth in TC conditions had in a high rate,a high density and a uniform length.

采用TO220封装的电子元件,研究了在温度循环条件下,元件Cu引脚上纯Sn镀层的Sn须生长行为。

Preparation procedure and mechanism of micro/nano tungsten oxide whiskers;

微/纳米氧化钨晶须的制备工艺及原理

Preparation of MgO whiskers and investigation on their influence factors;

氧化镁晶须制备及影响因素考查

Phase transformation behavior and growth mechanism of Ti(C,N) whiskers synthesized through carbothermal reduction process;

碳热还原合成Ti(C,N)晶须的相转变行为及生长机理