基本释义:

有引线器件装配

网络释义

1)through-hole assembly,有引线器件装配

2)leaded device,有引线器件

3)leads assembly,引线装配

4)electronic component lead,器件引线

5)leadless device,无引线器件

6)lead frame assembly system,引线框装配系统

用法和例句

Effect of cerium on solderability of tin coating on electronic component lead was studied.

探讨了稀土元素铈对电子元器件引线镀锡层可焊性的影响。