基本释义:

圆片规模集成化

网络释义

1)wafer scale integration,圆片规模集成化

2)wsi,圆片规模集成化

3)wafer,圆片

4)planchet,圆片

5)round-flat slitter,圆片刀

6)molybdenum disc,钼圆片

7)Circularity,圆片形

8)Steel thin disk,1C13钢圆片

9)?round saw blade,圆片锯

10)Turpinia Arguta Seen,山香圆片

用法和例句

The technique of wafer bonding is classified into three kinds: field-aided bonding, surface activated bonding, and intermediate layers bonding.

将圆片键合的各种工艺分为3类:场助直接键合、表面活性键合、借助中介层键合。

This paper summarized common problems of the rough of the ultra-fine grain cemented carbide round-flat slitter during the productions, and compared the different productions process of the rough round-flat slitter, these gave the powerful proof for produced high quality and eligible ultra-fine cemented carbide productions.

本文就超细晶粒硬质合金圆片刀毛坯在两种不同生产工艺过程中常见的问题加以综述,并对圆片刀毛坯的不同生产工艺进行对比性研究,为生产高质量、高合格率的超细硬质合金产品提供了有力的依据。

The problems of spots occurring on the surface of products in making molybdenum discs from small molybdenum slabs are mainly studied.

主要研究了小钼板坯在制成钼圆片的过程中产品表面易出现麻点、黄斑的问题,通过实验找到了问题产生的一些原因,特别指出了原料中的杂质含量对钼圆片的质量有着重要影响。