stud bump bonding (SBB)

精品项目网 2024-05-21 00:32:42

基本释义:

柱形凸起焊接

网络释义

1)stud bump bonding (SBB),柱形凸起焊接

2)cylinder jut,柱形凸起

3)welding lug,焊接凸起部

4)Solder Bump on Copper Stud,铜接线柱焊凸(SBC)

5)gibbous surface of the half-columniform conductor,半圆柱形凸起

6)projection weld,凸焊焊接

用法和例句

This paper intends to analyze influence of cylinder conductor for uniform electric field,and explains that the reason of easy breakdown of condenser with semicircle cylinder jut is that the electric field strength of the bulgiest position is two times as much as that of position far from the cylinder jut.

分析了柱形导体对均强电场的影响并以此为依据说明了有柱形凸起的高压电容器易击穿的原因是最凸部场强为远离凸部场强的 2倍。

The surface charge density of the infinite conductor and wedge-shaped conductor as well as the gibbous surface of the half-columniform conductor is calculated in detail.

对无限大导体表面,楔形导体表面,半圆柱形凸起表面电荷面密度进行了具体的计算,结果表明在静电平衡的条件下导体表面虽曲率相同,但表面电荷面密度却可以不同。

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