基本释义:

撞击焊,焊接凸点

网络释义

1)solder bump,撞击焊;焊接凸点

2)bonding pedestal,焊接凸点

3)projection weld,凸焊焊接

4)projection welding,凸焊;多点凸焊

5)spot welding,点焊接 、点焊

6)Solder bump,焊料凸点

用法和例句

In this paper, a low cost flip chip interconnection is introduced, which electrolessNi as the under bump metallurgy (UBM), deposits solder paste using stencil printing, and reflowsthe paste to form solder bumps.

回顾了低成本制备芯片上焊料凸点的方法,即化学镀镍制备凸点下金属层、模版印刷焊料,最后回流形成焊料凸点,并综述了该方法的最新研究进展。