基本释义:

中值，介质，微电子设备

网络释义

1)med,中值，介质，微电子设备

2)micro-electronic equipment,微电子设备

3)Mediation Device,中介设备

4)package equipment for micro-electron,微电子封装设备

5)communicating micro-electronic equipments,通讯微电子设备

6)cooling of micro-electronic equipment,微电子设备冷却

用法和例句

Fully automatic gold wire bonder is the key device of the package equipment for micro-electrons, which is associated with integrating technologies of fine mechanics, automatic control, image recognition, computer application, optics and ultrasonic wave bond.

全自动金丝球焊机是微电子封装设备中的核心设备 ,它是集精密机械、自动控制、图像识别、计算机应用、光学、超声波焊接等多领域技术于一体的现代高技术微电子生产设备。

This paperresearchesthe grounding problem aboutcommunicating micro-electronic equipmentsin a buildingand pointsoutthat,in ordertosureoperativesave oflight ning - protection to the communicating micro - electric equipments,on a good grounding base,the (leading,leaking cutting off,eliminating,defense,avoiding) are used asthetotal measuretolightning- protection.

研究了大楼内通讯微电子设备的接地问题，指出了为确保通讯微电子设备防雷运行安全，应在良好的接地的基础上，采用引、泄、堵、消、防、避等综合防雷措施。