基本释义:

主板级，装板的

网络释义

1)ONB ON Board,主板级，装板的

2)Board level packaging,板级封装

3)board level assembly,板级组装

4)fabricated plate,装配的板

5)plate mounting,板的安装

6)board-level electronic package,板级电子封装

用法和例句

Dynamic Bending Experiment and Numerical Study of Board Level Electronics Package;

板级电子封装动态弯曲实验及其数值模拟

electron gun vacuum lock

电子枪真空密封装置

Study on the Encapsulation of Organic Light-emitting Diode Materials with AAO;

AAO模板封装有机电致发光材料的研究

Application of ESPI in Solder Ball Failure Test on Board-Level BGA Package

ESPI在板级BGA封装器件焊球失效检测中的应用

EM China covers semiconductor manufacturing, packaging, SMT, PCB and related test and measurement equipment and technology.

《电子制造》 重点关注半导体制造与封装、表面贴装技术与印刷线路板及相关的测试与测量技术，

Electrical Simulation Research for IC Package Via

集成电路封装基板过孔电学仿真技术研究

A novel embedded power filter structure research in System-in-Package

系统级封装新型埋入式电源滤波结构的研究

The FEA Simulation of Moisture Diffusion in Electronic Packages;

塑料电子封装件中湿扩散有限元分析

Study on Electroless Ni-P Film Plating in Microelectronic Packaging

微电子封装中化学镀Ni-P薄膜研究

Electron-induced Damage of CMOS with Shielded Packages

屏蔽材料封装CMOS器件的电子辐照损伤

Fundamental Study of Novel Si-Al Electronic Packaging Materials

新型电子封装Si-Al合金的基础研究

The Application of "5S" Activity in Electronic Packaging Industry

“5S”管理在电子封装企业中的应用

Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module

混合封装电力电子集成模块内电磁干扰的屏蔽

Study on the Reliability of SMT Solder Joint in Electronic Packaging;

电子封装中表面贴装焊点的可靠性研究

Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;

基于倒装焊接的电子封装器件热性能的研究

Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;

微电子封装高聚物热、湿—机械特性及其封装可靠性研究

Design of ATE on digital circuit boards of electronic equipments

电子装备数字电路板自动检测仪设计

The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging

微电子封装用各向异性导电胶膜的研究进展